FTDI Chip开发创新的硅解决方案，增强与最新全球技术的互动。FTDI Chip的主要目标是“桥接技术”，以支持具有高度复杂，功能丰富，功能强大且易于使用的产品平台的工程师。这些平台可实现电子设计的创建，具有高性能，低外设元件要求，低功耗预算和最小的电路板空间。

FTDI Chip历史悠久，不断扩展的通用串行总线（USB）产品线拥有普遍认可的产品品牌，如无处不在的R-Chip，X-Chip，Hi-Speed和SuperSpeed USB 3.0系列。除主机和桥接芯片外，它还包括具有内置微控制器功能的高度集成的系统解决方案。FTDI Chip的嵌入式视频引擎（EVE）图形控制器将显示，音频和触摸功能打包到单个芯片上。这些集成电路采用独特的流线型方法，可显着缩短下一代人机界面（HMI）实施所需的开发时间和物料清单成本。 FTDI芯片还提供具有增强连接功能的高度差异化，速度优化的微控制器单元（MCU）系列，专门针对其USB和显示器产品线而设计。这些MCU适用于关键应用，可以通过其卓越的处理性能和高水平的运营效率来增加价值。

FTDI Chip是一家无晶圆厂半导体公司，与世界领先的代工厂合作。总部位于英国格拉斯哥，在格拉斯哥，新加坡和台北（台湾）设有研发机构，在格拉斯哥，台北，泰格（俄勒冈州，美国）和上海（中国）设有区域销售和技术支持站点。

FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. These platforms enable creation of electronic designs with high performance, low peripheral component requirements, low power budgets and minimal board real estate.

FTDI Chip’s long-established, continuously expanding Universal Serial Bus (USB) product line boasts such universally recognized product brands as the ubiquitous R-Chip, X-Chip, Hi-Speed and SuperSpeed USB 3.0 series. In addition to both host and bridge chips, it includes highly-integrated system solutions with built-in microcontroller functionality. The company’s Embedded Video Engine (EVE) graphic controllers each pack display, audio and touch functionality onto a single chip. The unique, streamlined approach utilised by these ICs allow dramatic reductions in the development time and bill-of-materials costs involved in next generation Human Machine Interface (HMI) implementation. FTDI Chip also provides families of highly-differentiated, speed-optimised microcontroller units (MCUs) with augmented connectivity features, specifically designed with compatibility to its USB and Display product lines in mind. These MCUs are targeted for key applications where they can add value with their superior processing performance and high levels of operational efficiency.

FTDI Chip is a fab-less semiconductor company, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China).